| 摘要 |
<p>Provided is a liner, serial chip/substrate assemble processor for moving a preset assembled chip/die substrate onto a support substrate by a series of sealing chambers which have movable bottom processing sections. A process starts at a loading station and ends at unloading station after various melting and vacuum of chip/substrate components which is supported on a device tray by various types of their chambers until a final combination. [Reference numerals] (AA) Load/lock station</p> |
