ADAPTIVE UNIFORM POLISHING SYSTEM

摘要

An adaptive uniform polishing system is equipped with feedback control to apply localized adjustments during a polishing operation. The adaptive uniform polishing system disclosed has particular application to the semiconductor industry. Such an adaptive uniform polishing system includes a rotatable head that holds a semiconductor wafer, and a processing unit structured to be placed in contact with an exposed surface of the wafer. The processing unit includes a rotatable macro-pad and a plurality of rotatable micro-pads that can polish different portions of the exposed surface at different rotation speeds and pressures. Thus, uniformity across the exposed surface can be enhanced by applying customized treatments to different areas. Customized treatments can include the use of different pad materials and geometries. Parameters of the adaptive uniform polishing system are programmable, based on in-situ data or data from other operations in a fabrication process, using advanced process control.

主权项

1. A system configured to uniformly planarize a semiconductor wafer, the system comprising:
a head configured to hold the semiconductor wafer; and a pad drive unit structured to retain a plurality of polishing pads, the pad drive unit including:
a macro-pad;a plurality of micro-pads adjacent to one another, the micro-pads positioned to be placed in physical contact with different portions of the exposed surface of the semiconductor wafer, each micro-pad independently rotatable around a local axis; anda plurality of drive units, each drive unit coupled to a respective micro-pad.