Reducing Far End Crosstalk in Single Ended Interconnects and Buses

摘要

Inductive coupling arising between adjacent vias in interconnect technologies (commonly associated with printed circuit boards or package) can be combatted through the addition of metal plates to vias. The plates generate capacitive coupling that can compensate for the inductive crosstalk normally generated between vias in printed circuit boards or packages. When the added plates of two neighboring vias overlap with each other, a capacitive coupling is generated. By balancing the inductive coupling with capacitive coupling, an effective reduction of far end crosstalk may be obtained.

主权项

1. A method comprising:
reducing far end crosstalk by forming a capacitor that counteracts inductive crosstalk between adjacent conductors.