POWER MODULE

摘要

A power module is disclosed. The power module includes a first substrate, a first metal layer, at least one conductive structure and at least one power device. The first metal layer is disposed on the first substrate. The first metal layer has a first thickness d1. The first thickness d1 satisfies: 5 μm≦d1≦50 μm. The conductive structure is disposed at a position different to the first metal layer on the first substrate. The conductive structure has a second thickness d2. The second thickness d2 satisfies: d2≧100 μm. The power device is disposed on the first substrate, the first metal layer or the conductive structure. The driving electrode of the power device is electrically connected to the first metal layer. The power electrode of the power device is electrically coupled to the conductive structure.

主权项

1. A power module, comprising:
a first substrate; a first metal layer, disposed on the first substrate, the first metal layer having a first thickness d1, wherein the first thickness d1 satisfies: 5 μm≦d1≦50 μm; at least one conductive structure, disposed at a position different to the first metal layer on the first substrate, the conductive structure having a second thickness d2, wherein the second thickness d2 satisfies: d2≧100 μm; and at least one power device, disposed on the first substrate, the first metal layer or the conductive structure, wherein a driving electrode of the power device is electrically coupled to the first metal layer, and at least one power electrode of the power device is electrically coupled to the conductive structure.