| 发明名称 |
Multi-Chip Package Structure and Method of Forming Same |
| 摘要 |
A device comprises a first semiconductor die embedded in a molding compound layer, a surface-mount device embedded in the molding compound layer, a plurality of interconnect structures formed on the molding compound layer, wherein the first semiconductor die is electrically coupled to the interconnect structures and the surface-mount device is electrically coupled to the interconnect structures through at least one V-shaped via and a plurality of bumps formed on and electrically coupled to the interconnect structures. |
| 申请公布号 |
US2015084190(A1) |
申请公布日期 |
2015.03.26 |
| 申请号 |
US201414561581 |
申请日期 |
2014.12.05 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Hung Jui-Pin;Yu Chen-Hua;Lin Jing-Cheng;Yeh Der-Chyang |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A device comprising:
a first semiconductor die embedded in a molding compound layer; a surface-mount device embedded in the molding compound layer; a plurality of interconnect structures formed on the molding compound layer, wherein:
the first semiconductor die is electrically coupled to the interconnect structures; andthe surface-mount device is electrically coupled to the interconnect structures through at least one V-shaped via; and a plurality of bumps formed on and electrically coupled to the interconnect structures. |
| 地址 |
Hsin-Chu TW |
