发明名称 |
Substrate Bonding Apparatus and Substrate Bonding Method |
摘要 |
A substrate bonding apparatus that bonds a first substrate and a second substrate together, comprising a joining section that joins the first substrate and second substrate together aligned to each other for stacking; a detecting section that detects an uneven state on at least one of the first substrate and second substrate prior to joining by the joining section; and a determining section that determines whether the uneven state detected by the detecting section satisfies a predetermined condition, wherein the joining section does not join the first substrate and the second substrate if it is determined by the determining section that the uneven state does not satisfy the predetermined condition. |
申请公布号 |
US2015083786(A1) |
申请公布日期 |
2015.03.26 |
申请号 |
US201414497424 |
申请日期 |
2014.09.26 |
申请人 |
NIKON CORPORATION |
发明人 |
OKAMOTO Kazuya;SUGAYA Isao;KURATA Naohiko;OKADA Masashi;MITSUISHI Hajime |
分类号 |
H01L23/00;B23K37/04;H01L21/66;H01L21/68 |
主分类号 |
H01L23/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
Tokyo JP |