发明名称 POLISHING COMPOSITION
摘要 The present invention is a polishing composition containing: silica having functional groups that satisfy at least one of the following conditions (1) and (2), the functional groups immobilized on the surface of the silica; and a pH adjuster. Condition (1): The functional groups have amino groups. Condition (2): The functional groups have halogeno groups. This polishing composition makes it possible to adequately control the polishing rate of Si-containing material.
申请公布号 WO2015040979(A1) 申请公布日期 2015.03.26
申请号 WO2014JP71209 申请日期 2014.08.11
申请人 FUJIMI INCORPORATED 发明人 SUZUKI, SHOTA;IZAWA, YOSHIHIRO
分类号 C09K3/14;B24B37/00;C09G1/02;H01L21/304 主分类号 C09K3/14
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