| 摘要 |
<p>The present invention relates to a composite copper particle, comprising a parent particle of copper having an average particle diameter of 0.2-10μm, which contains therein a plurality of inorganic oxide particles having an average particle diameter of 5-50 nm. The inorganic oxide particles include particles that are completely embedded in the parent particle near the surface thereof and particles that are embedded in the parent particle in a condition of being partially exposed on the surface of the parent particle. The content of the inorganic particles is 0.1-5wt% relative to the total weight of the composite copper particle.</p> |
