发明名称 COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING BOARD
摘要 A method for manufacturing a combined wiring board includes preparing multiple wiring boards, preparing a metal frame having opening portions which accommodate the boards, respectively, positioning the boards in the opening portions of the frame, respectively, and forming multiple crimped portions in the frame by plastic deformation such that the sidewalls of the boards bond to sidewalls of the opening portions in the frame. The preparing of the boards includes forming the sidewalls of the boards such that when the boards are positioned in the opening portions of the frame, the sidewalls of the boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the frame, and the forming of the crimped portions includes generating the deformation such that the sidewalls of the opening portions in the frame abut the narrow-space portions of the boards before the wide-space portions of the boards.
申请公布号 US2015085461(A1) 申请公布日期 2015.03.26
申请号 US201414492424 申请日期 2014.09.22
申请人 IBIDEN CO., LTD. 发明人 ISHIHARA Teruyuki;TAKAHASHI Michimasa
分类号 H05K7/10;H05K3/36 主分类号 H05K7/10
代理机构 代理人
主权项 1. A method for manufacturing a combined wiring board, comprising: preparing a plurality of wiring boards; preparing a metal frame having a plurality of opening portions configured to accommodate the plurality of wiring boards, respectively; positioning the wiring boards in the opening portions of the metal frame, respectively; and forming a plurality of crimped portions in the metal frame by plastic deformation such that the sidewalls of the wiring boards bond to sidewalls of the opening portions in the metal frame, wherein the preparing of the wiring boards includes forming the sidewalls of the wiring boards such that when the wiring boards are positioned in the opening portions of the metal frame, the sidewalls of the wiring boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the metal frame, and the forming of the crimped portions includes generating the plastic deformation such that the sidewalls of the opening portions in the metal frame abut the narrow-space portions of the sidewalls of the wiring boards before the wide-space portions of the sidewalls of the wiring boards.
地址 Ogaki-shi JP