发明名称 |
SEMICONDUCTOR LIGHT EMITTING DEVICE WITH CONTACT FORMED ON TEXTURED SURFACE |
摘要 |
PROBLEM TO BE SOLVED: To provide a flip chip semiconductor light emitting device that does not require a thick contact to compensate for a difference in height between a top of a p-type region and a top of an n-type region.SOLUTION: The device includes a semiconductor structure comprising a light emitting layer 24 disposed between an n-type region 22 and a p-type region 26. The semiconductor structure includes an n-contact region 23 and a p-contact region 25. A cross section of the n-contact region comprises a plurality of first regions wherein portions of the light emitting layer and p-type region are removed to expose the n-type region. The plurality of first regions are separated by a plurality of second regions wherein the light emitting layer and p-type region remain in the device. The device further includes a first metal contact 40 formed over the semiconductor structure in the p-contact region and a second metal contact 38 formed over the semiconductor structure in the n-contact region. The second metal contact is in electrical contact with at least one of the second regions in the n-contact region. |
申请公布号 |
JP2015057845(A) |
申请公布日期 |
2015.03.26 |
申请号 |
JP20140226825 |
申请日期 |
2014.11.07 |
申请人 |
PHILIPS LUMILEDS LIGHTNG CO LLC;KONINKLIJKE PHILIPS NV |
发明人 |
EPLER JOHN E |
分类号 |
H01L33/38 |
主分类号 |
H01L33/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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