| 发明名称 |
SEMICONDUCTOR DEVICE LEADFRAME |
| 摘要 |
For so called film assisted moulding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion. |
| 申请公布号 |
US2015084175(A1) |
申请公布日期 |
2015.03.26 |
| 申请号 |
US201414478683 |
申请日期 |
2014.09.05 |
| 申请人 |
NXP B.V. |
发明人 |
van Straten Freek Egbert;Incomio Jeremy Joy Montalbo;Reijs Albertus |
| 分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A lead frame for a semiconductor device manufactured by film assisted moulding, the lead frame comprising: a connection lead, the connection lead comprising a connection portion for electrical connection to a semiconductor die, wherein an edge of said connection portion comprises a recessed portion wherein the recessed portion is arranged to seal against a film during moulding of the semiconductor device. |
| 地址 |
Eindhoven NL |
