Electronic Device, Test Board, and Semiconductor Device Manufacturing Method

摘要

Electrical characteristics of a mounting board over which a semiconductor device is mounted is improved. A mounting board (wiring board) includes a plurality of first through holes and second through holes extending from its upper surface bearing a semiconductor device (semiconductor package) to its lower surface and through-hole wirings formed in the respective through holes. The mounting board has a capacitor arranged on its lower surface and electrically connected with the semiconductor device via second electrodes. Among a plurality of first electrodes formed on the upper surface of the mounting board, the several first electrodes to be connected with the capacitor are connected with one wiring formed in a first through hole with a larger diameter than a signal transmission path.

主权项

1. An electronic device comprising:
a first wiring board having a first surface, a plurality of first electrodes formed over the first surface, a second surface opposite to the first surface, a plurality of second electrodes formed over the second surface, and a plurality of holes extending from one of the first surface and the second surface to the other surface; a semiconductor package including a semiconductor chip, a second wiring board electrically connected with the semiconductor chip, and a plurality of external terminals formed over a mounting surface of the second wiring board, the semiconductor package being fixed to the first surface of the first wiring board; and a capacitor having a first terminal and a second terminal, and being mounted over the second surface of the first wiring board, wherein the external terminals of the semiconductor package are electrically connected with the first electrodes of the first wiring board, respectively, wherein the first and second terminals of the capacitor are electrically connected with first and second terminal electrodes among the second electrodes of the first wiring board, respectively, wherein a thickness of the first wiring board is larger than that of the second wiring board, wherein the first electrodes include a plurality of power-supply-voltage-first-electrodes, a plurality of reference-voltage-first-electrodes and a plurality of signal-first-electrodes, wherein the holes include a power supply voltage hole, a reference voltage hole, and a plurality of signal holes, wherein a diameter of each of the power supply voltage hole and the reference voltage hole is larger than a diameter of each of the signal holes, wherein in plan view, the power supply voltage hole overlaps part of each of the power-supply-voltage-first-electrodes and the first terminal electrode, wherein in plan view, the reference voltage hole overlaps part of each of the reference-voltage-first-electrodes and the second terminal electrode, wherein the power-supply-voltage-first-electrodes are connected with one another via a power supply voltage wiring formed inside of the power supply voltage hole, wherein the reference-voltage-first-electrodes are connected with one another via a reference voltage wiring formed inside of the reference voltage hole, wherein the signal-first-electrodes are separated from one another, wherein each of the power-supply-voltage-first-electrodes is electrically connected with the first terminal electrode via the power supply voltage wiring, and wherein each of the reference-voltage-first-electrodes is electrically connected with the second terminal electrode via the reference voltage wiring.