| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device having an electric insulation bank structure with a side wall that defines a well.SOLUTION: A method of manufacturing an electronic device having an electric insulation bank structure with a side wall that defines a well, includes: a step of forming a bank structure so that the side wall comprises a first inclined plane extended from a surface layer region and a second inclined plane with steeper inclination extended from the first inclined plane, a surface energy discontinuity being provided at a point on the second inclined plane separated from the first inclined plane; a step of forming a layer structure having at least one layer formed of an organic semiconductor material by depositing a solution of a material on the well, the deposited solution wetting the first and second inclined planes to a pinning point in surface energy discontinuity; and a step of drying the deposited solution.</p> |
