SEMICONDUCTOR MANUFACTURING APPARATUS

摘要

A lower mold (2) of a set of upper and lower molds for resin encapsulation of a lead frame having a semiconductor chip mounted thereon is provided with a tapered positioning pin (3) to be engaged with a positioning hole formed in the lead frame. A columnar portion of the tapered positioning pin has an outer diameter larger than an inner diameter of a positioning hole. An ejector pin (4) and an ejector pin in a pair (5) for ejecting a package out of the molds after the molding are fixed town ejector pin coupling mechanism (6).

主权项

1. A semiconductor manufacturing apparatus configured to sandwich a lead frame on which a semiconductor chip is mounted between a set of an upper mold and a lower mold and to fill and mold a resin at a predetermined position, the semiconductor manufacturing apparatus comprising:
a tapered positioning pin provided to the lower mold, the tapered positioning pin including a columnar portion having an outer diameter larger than an inner diameter of a positioning hole at an upper surface of the lead frame; and an ejector pin in a pair with the tapered positioning pin, provided at a distance from the tapered positioning pin, the distance being determined by a thickness of the lead frame.