| 发明名称 |
COOLING ASSEMBLY USING HEATSPREADER |
| 摘要 |
Various embodiments relate to a microchip die cooling assembly comprising a circuit board; a microchip having an exposed die attached to the circuit board; a heatspreader having a top side and a bottom side; a heat sink having a bottom side and a top side comprising a cooling structure; a first thermal interface material in contact with the exposed die and the bottom side of the heatspreader; and a second thermal interface material in contact with the top side of the heat spreader and the bottom side of the heat sink. |
| 申请公布号 |
US2015084182(A1) |
申请公布日期 |
2015.03.26 |
| 申请号 |
US201314037706 |
申请日期 |
2013.09.26 |
| 申请人 |
ALCATEL LUCENT CANADA, INC. |
发明人 |
DE CECCO STEFANO F.;CHESHIRE GREGORY W. |
| 分类号 |
H01L23/36;H01L21/48 |
主分类号 |
H01L23/36 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A microchip die cooling assembly comprising:
a circuit board; a microchip having an exposed die attached to the circuit board; a heatspreader having a top side and a bottom side, the bottom side being positioned above the microchip; a heat sink having a bottom side and a top side comprising a cooling structure; a first thermal interface material in contact with the exposed die and the bottom side of the heatspreader; a second thermal interface material in contact with the top side of the heat spreader and the bottomside of the heat sink; a pin securing the heatspreader to the circuit board; and a spring connected to the pin to bias the heatspreader against the chip die. |
| 地址 |
Ottawa CA |
