LEAD FRAME, ELECTRONIC CONTROL DEVICE USING LEAD FRAME, AND LEAD-FRAME MOUNTING METHOD

摘要

Conventional lead frames can neither be made self-supporting nor be picked up by an automatic mounter via suction and mounted on a circuit board. This lead frame (15) comprises the following: a plurality of leads (15d), each of which has a land-connection section (15c) formed on one end of a pin-shaped terminal (15a) with a bent section (15b) interposed therebetween; and a joining section (15e) that joins said leads (15d) together. The joining section (15e) joins the ends of the land-connection sections (15c) together so as to form a base plate that makes the leads (15d) vertical and/or has a suction surface (15f) that can be picked up by an automatic lead-frame mounting device via suction.