| 摘要 |
The present invention is to provide a semiconductor device of miniaturization and high reliability. Inverse-cone-shaped concave parts (2) are installed in the semiconductor chip holding region (3) of the surface of an island part (1) which holds a semiconductor chip. At least one side of the inverse-cone-shaped concave parts (2) faces the closest outer surface of the rectangular semiconductor chip holding region (3) in parallel. The peak of the opposite side to the one side faces the inside of the semiconductor chip holding region (3). |
