发明名称 LASER PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a laser processing apparatus capable of generating cleavage/rupture up to a deep position within a workpiece as compared with a conventional technique and forming a division origin at a time of dividing the workpiece.SOLUTION: A laser processing apparatus for irradiating a workpiece with laser beams and processing the workpiece, includes: a stage onto which the workpiece is fixed; and an optical system for irradiating, from an irradiation lens, the workpiece fixed onto the stage with pulse laser beams emitted from a laser light source. The optical system includes branching means for optically branching one pulse laser beam emitted from the laser light source to pass along a plurality of branch optical paths, the branch optical paths commonly including the irradiation lens, and including a group of lenses different in composite focal length, respectively so that a plurality of pulse laser beams radiated on an irradiation target position via the branch optical paths from the irradiation lens has different focal positions.
申请公布号 JP2015057296(A) 申请公布日期 2015.03.26
申请号 JP20140234256 申请日期 2014.11.19
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 NAKATANI FUMIYOSHI;IWATSUBO YUMA
分类号 B23K26/067;B23K26/53;H01L21/301 主分类号 B23K26/067
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