| 发明名称 |
IMAGE PICKUP APPARATUS, SEMICONDUCTOR APPARATUS, AND IMAGE PICKUP UNIT |
| 摘要 |
An image pickup apparatus includes: an image pickup chip including a light receiving section and electrode pads, on a first main face, and a plurality of connection electrodes, each of which is connected to each of the electrode pads via each of a plurality of through-hole interconnections, on a second main face; a transparent cover glass having a larger plan-view dimension than the image pickup chip; a transparent adhesive layer that bonds the first main face of the image pickup chip and the cover glass; and a sealing member that covers a side face of the image pickup chip and a side face of the adhesive layer, and is made of an insulating material having a same plan-view dimension as the cover glass. |
| 申请公布号 |
US2015085094(A1) |
申请公布日期 |
2015.03.26 |
| 申请号 |
US201414556831 |
申请日期 |
2014.12.01 |
| 申请人 |
OLYMPUS CORPORATION |
发明人 |
FUJIMORI Noriyuki;IGARASHI Takatoshi;YOSHIDA Kazuhiro |
| 分类号 |
H01L27/146;H01L23/31;H01L23/00;H04N5/369 |
主分类号 |
H01L27/146 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An image pickup apparatus comprising:
an image pickup chip including a light receiving section and electrode pads formed around the light receiving section, on a first main face, and a plurality of connection electrodes, each of which is connected to each of the electrode pads via each of a plurality of through-hole interconnections, on a second main face; a transparent support substrate section having a larger plan-view dimension than the image pickup chip; a transparent adhesive layer that bonds the first main face of the image pickup chip and the support substrate section; and a sealing member that covers a side face of the image pickup chip and a side face of the adhesive layer, and is made of an insulating material having a same plan-view dimension as the support substrate section. |
| 地址 |
Tokyo JP |
