METHOD FOR INSPECTING DIES ON WAFER

摘要

The present invention relates to a method for inspecting dies on a wafer comprising the following steps of: forming a carrier disk by attaching UV dicing tape to a hollow area of a carrier ring; attaching a wafer on which a plurality of dies are installed to a first surface of the UV dicing tape; forming a transparent film including an area including an entire measurement area of a second surface by applying polymer tape to a second surface of the UV dicing service; disposing the carrier disk to which the wafer is attached at a position corresponding to a microscope; generating a capture image by observing a targeted die on the wafer by using the microscope; comparing and contrasting the capture image with a given contrast image; and determining the targeted die as a defective die when the capture image does not match the given contrast image. By forming the transparent film, an integrated circuit layout in a die on a wafer can be clearly observed through a microscope.