| 摘要 |
An LED based illumination device includes LEDs mounted to an LED mounting board, an integrated output window sub-assembly, and a thermal frame coupled between the integrated output window sub-assembly and the LED mounting board. The integrated output window sub-assembly may include an output window and a thermally conductive ring coupled to the perimeter surface of the output window. The thermally conductive ring may have a radial width equal to or greater than the thickness of the output window. Additionally, the output window and the thermally conductive ring may have coplanar top and bottom surfaces. The thermally conductive ring surrounding the perimeter of the output window may include one or more pockets into which a curable, thermally conductive bonding material is disposed in an uncured state and flows into a gap between the perimeter of the output window and the thermally conductive ring. |
