| 发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SIDE SOLDERABLE LEADS AND METHOD OF MANUFACTURE THEREOF |
| 摘要 |
A system and method of manufacture of an integrated circuit packaging system includes: a leadframe having a side solderable lead with a half-etched lead portion and a lead top side; a mold body directly on the leadframe and the side solderable lead, the lead top side of the side solderable lead exposed from the mold body; a mold groove in the mold body and in a portion of the side solderable lead for exposing a lead protrusion of the side solderable lead on an upper perimeter side of the mold body; and the half-etched lead portion exposed from a lower perimeter side of the mold body. |
| 申请公布号 |
US2015084172(A1) |
申请公布日期 |
2015.03.26 |
| 申请号 |
US201314037838 |
申请日期 |
2013.09.26 |
| 申请人 |
Do Byung Tai;Espiritu Emmanuel;Ilagan Allan P.;Roque Marites Laguipo |
发明人 |
Do Byung Tai;Espiritu Emmanuel;Ilagan Allan P.;Roque Marites Laguipo |
| 分类号 |
H01L23/495;H01L23/00 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a leadframe having a side solderable lead with a half-etched lead portion and a lead top side; forming a mold body directly on the leadframe and the side solderable lead, the lead top side of the side solderable lead exposed from the mold body; removing a portion of the mold body and a portion of the side solderable lead for forming a mold groove in the mold body to expose a lead protrusion of the side solderable lead on an upper perimeter side of the mold body; and singulating the mold body and the leadframe for exposing the half-etched lead portion from a lower perimeter side of the mold body. |
| 地址 |
Singapore SG |
