| 发明名称 |
BALL GRID ARRAY PACKAGED CAMERA DEVICE SOLDERED TO A SUBSTRATE |
| 摘要 |
An assembly that attaches a ball grid array (BGA) packaged camera device to a printed circuit board (PCB) substrate is provided. The assembly includes a spacer between the device and the substrate. The spacer is configured to prevent excessive collapse of solder balls located between the device and the substrate during reflow of the solder balls. The spacer includes one of solder mask, tape, and/or legend ink. |
| 申请公布号 |
US2015084150(A1) |
申请公布日期 |
2015.03.26 |
| 申请号 |
US201314036017 |
申请日期 |
2013.09.25 |
| 申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
PAN BINGHUA;LOW YEW KWANG;YONG SIM YING |
| 分类号 |
H01L31/02;H01L27/146 |
主分类号 |
H01L31/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An assembly that attaches a ball grid array (BGA) packaged camera device to a printed circuit board (PCB) substrate, said assembly comprising:
a spacer between the device and the substrate, said spacer configured to prevent excessive collapse of solder balls located between the device and the substrate during reflow of the solder balls, wherein the spacer comprises one of solder mask, tape, and legend ink. |
| 地址 |
TROY MI US |
