IMAGE PICKUP MODULE AND METHOD FOR MANUFACTURING IMAGE PICKUP MODULE

摘要

The present invention achieves reduction in size and thickness while removing the cause of defective image and the like. According to an image pickup module (1), a solid-state image pickup device (3) and a flexible substrate (2) are connected to each other by flip-chip bonding, and an opening (5) is formed in the flexible substrate 2 by melting the flexible substrate (2) and an anisotropically-conductive film (8) adhered to the flexible substrate (2).

主权项

1. An image pickup module comprising:
a solid-state image pickup device having a light receiving section and an electrode pad; a substrate having an opening, a wiring pattern which is connected to the electrode pad by flip-chip bonding being formed on the substrate; an anisotropically-conductive film which is adhered to the substrate so that the substrate and the solid-state image pickup device are connected to each other via the anisotropically-conductive film; and a light-transmitting member provided in the opening, the light-transmitting member causing light to pass through so that the light is to be received by the light receiving section, the opening being formed by melting the substrate and the anisotropically-conductive film, and at an edge of the opening, the anisotropically-conductive film being hardened while retaining a melted shape which has been formed by the melting.