| 摘要 |
A circuit board assembly is described. The circuit board assembly comprises a circuit board (2) comprising a substrate (4) supporting a plurality of contact lands (9; Fig. 2) and a device (3), such as a bare die or printed circuit board, comprising a plurality of contact pads (12: Fig. 3) which is mounted on the circuit board such that the contact pads are aligned with the contact lands. The circuit board assembly comprises an interconnect layer (15) which has a sheet resistance, RS, of at least 0.5 MΩ/sq, which is disposed between the device and the circuit board and which is arranged to provide electrical connections between the contact lands and corresponding contact pads. |
