发明名称 IMPRINTED MULTI-LEVEL MICRO-WIRE CIRCUIT STRUCTURE
摘要 <p>An imprinted multi-level micro-wire structure includes a substrate 6 and a first layer 10 formed over the substrate. The first layer includes first micro-wires 14 formed in first micro-channels 12 imprinted in the first layer. A second layer 20 is formed in contact with the first layer. The second layer includes second micro-wires 24 formed in second micro-channels 22 imprinted in the second layer. At least one of the second micro-wires is in electrical contact with at least one of the first micro-wires.</p>
申请公布号 WO2015041870(A1) 申请公布日期 2015.03.26
申请号 WO2014US54261 申请日期 2014.09.05
申请人 EASTMAN KODAK COMPANY 发明人 COK, RONALD, STEVEN
分类号 H05K1/02;G06F3/041;H05K1/09;H05K1/18;H05K3/12;H05K3/46 主分类号 H05K1/02
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