发明名称 |
IMPRINTED MULTI-LEVEL MICRO-WIRE CIRCUIT STRUCTURE |
摘要 |
<p>An imprinted multi-level micro-wire structure includes a substrate 6 and a first layer 10 formed over the substrate. The first layer includes first micro-wires 14 formed in first micro-channels 12 imprinted in the first layer. A second layer 20 is formed in contact with the first layer. The second layer includes second micro-wires 24 formed in second micro-channels 22 imprinted in the second layer. At least one of the second micro-wires is in electrical contact with at least one of the first micro-wires.</p> |
申请公布号 |
WO2015041870(A1) |
申请公布日期 |
2015.03.26 |
申请号 |
WO2014US54261 |
申请日期 |
2014.09.05 |
申请人 |
EASTMAN KODAK COMPANY |
发明人 |
COK, RONALD, STEVEN |
分类号 |
H05K1/02;G06F3/041;H05K1/09;H05K1/18;H05K3/12;H05K3/46 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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