| 摘要 |
PROBLEM TO BE SOLVED: To provide an electromagnetic wave shield cover capable of electromagnetically shielding various terminals and various electronic components.SOLUTION: An electromagnetic wave shield cover can be manufactured by immersing a molding die in soft resin sol to apply and dry the soft resin sol and then in an electrically conductive resin solution to apply and dry the conductive resin solution. The electromagnetic wave shield cover has an electrically conductive resin layer laminated outside an inner layer formed of a soft resin layer. A soft resin layer may be further laminated outside the electrically conductive resin layer. The electrically conductive resin is preferably poly(3,4-ethylenedioxythiophene)/poly(4-styrenesulfonate) composite. A method of manufacturing the electromagnetic wave shield cover of the present invention includes simple processes, and the obtained electromagnetic wave shield cover has superior adhesive strength between the soft resin layer and the electrically conductive resin layer. The electromagnetic wave shield cover is soft on the whole and thereby easily covers terminals and components and has superior adhesiveness, so that electromagnetic shielding properties are superior. |
