| 摘要 |
<p>A wafer level packaging method of an electronic device according to an embodiment of the present invention, comprising the step of forming an electronic device layer in which an electronic device is formed and an adhesive layer on the front surface of a wafer including a pad for connecting the electronic device to the outside; forming a through-hole in a position corresponding to the pad of a photosensitive glass substrate; arraying the wafer and the photosensitive glass substrate to make the through-hole to be arranged on the pad, and bonding the adhesive layer and the photosensitive glass substrate; and forming a through-electrode by removing the adhesive layer corresponding to lower portion of the through-hole and filling the through-hole with a metal material.</p> |
