| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component embedded in a board and a multilayer ceramic electronic component-embedded printed circuit board.SOLUTION: The present invention provides a multilayer ceramic electronic component embedded in a board including: a ceramic body including a dielectric layer and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; an active layer including a plurality of first and second internal electrodes formed to be alternately exposed through both end surfaces of the ceramic body via the dielectric layer therebetween, to thereby form capacitance therein; upper and lower cover layers formed on upper and lower portions of the active layer; and first and second external electrodes formed on both ends of the ceramic body. In the multilayer ceramic electronic component embedded in a board, the first external electrode includes a first base electrode and a first terminal electrode formed on the first base electrode, the second external electrode includes a second base electrode and a second terminal electrode formed on the second base electrode, and 0.10≤tc1/tc2≤1.00 is satisfied where tc1 represents a thickness of the upper cover layer and tc2 represents a thickness of the lower cover layer.</p> |
