METHOD FOR MANUFACTURING MULTILAYER WIRING SUBSTRATE, AND THREE-DIMENSIONAL MODELING DEVICE USED FOR SAME

摘要

　To provide a method for manufacturing a multilayer wiring substrate in which the production process can be simplified and the production cost can be reduced, and a three-dimensional modeling device used for the method. Specifically, a method for manufacturing a multilayer wiring substrate obtained by stacking wiring layers comprising an electroconductive part (13) and an insulating part (14), wherein the method includes: a wiring layer formation step for discharging an electroconductive material or an insulating material onto a predetermined position while performing a scanning motion, causing the discharged material to accumulate to a predetermined thickness (Thn), and forming a wiring layer; and a wiring layer stacking step for discharging an electroconductive material or an insulating material onto a predetermined position on the surface of the wiring layer while performing a scanning motion, causing the discharged material to accumulate to a predetermined thickness (Thn), and forming a further wiring layer.