发明名称 CIRCUIT MODULE
摘要 <p>PROBLEM TO BE SOLVED: To provide a circuit module which has excellent shield effect and suitable for downsizing.SOLUTION: A circuit module according to the present embodiment comprises a circuit board, a mounting component, an encapsulation body and a shield. The circuit board has a mounting surface. The mounting component is mounted on the mounting surface. The encapsulation body is formed on the mounting surface; and covers the mounting component; has a trench formed from a principal surface of the encapsulation body toward the mounting surface. The trench has side walls composed of a first side wall part on the mounting surface side and a second side wall part on the principal surface side. The side wall part has first inclination and when assuming that a connection point of the first side wall part and the second side wall part is a first point and a connection point of the second side wall part and the principal surface is a second point, a straight line which links the first point and the second point has second inclination smaller than the first inclination. The shield covers the encapsulation body and has an inner shield part formed in the trench and an external shield arranged on the principal surface and the inner shield part.</p>
申请公布号 JP2015057804(A) 申请公布日期 2015.03.26
申请号 JP20130169428 申请日期 2013.08.19
申请人 TAIYO YUDEN CO LTD 发明人 SHIMAMURA MASAYA;KITAZAKI KENZO;MUGITANI HIDEJI;SARUWATARI TATSURO;SAJI TETSUO;NAKAMURA HIROSHI
分类号 H05K3/28;H01L23/28;H05K9/00 主分类号 H05K3/28
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