发明名称 STAMP-FACE PLATEMAKING DEVICE, MEDIUM HOLDER, AND MEDIUM HOLDER MANUFACTURING METHOD
摘要 A stamp-face platemaking device transports a medium holder inserted into a plate insertion portion to a printing unit. The medium holder holds a stamp face material at a center portion of a plate-like member, and has a cutout portion in one side end portion thereof. An optical sensor detects the top end portion of the medium holder on a sensor scanning line in the inserting direction, and the cutout start point and the cutout end point of the cutout portion. The size of the stamp face material in the inserting direction and/or the size of the stamp face material in a direction perpendicular to the inserting direction are set based on the positions of two of the detected end portions. When the cutout end point is detected, platemaking with the stamp face material is started. The cutout portion can have a wedge-like shape or a U-shape, or can change its positions and/or sizes.
申请公布号 US2015084257(A1) 申请公布日期 2015.03.26
申请号 US201414490388 申请日期 2014.09.18
申请人 CASIO COMPUTER CO., LTD. 发明人 YUNO Hirotaka;ARII Tadashi
分类号 B23Q1/03;B41J11/00;B41J25/02 主分类号 B23Q1/03
代理机构 代理人
主权项 1. A stamp-face platemaking device comprising: a plate insertion portion; a cutout portion detecting unit configured to detect respective positions of a top end portion of a medium holder on a sensor scanning line in an inserting direction, one cutout end portion of the cutout portion, and the other cutout end portion of the cutout portion when the medium holder holding a stamp face material and having the cutout portion formed in a side end portion thereof is inserted into the plate insertion portion; and a size setting unit configured to set at least one of a size of the stamp face material in the inserting direction and a size of the stamp face material in a direction perpendicular to the inserting direction based on the positions of at least two end portions among the top end portion on the sensor scanning line, the one cutout end portion, and the other cutout end portion detected by the cutout portion detecting unit.
地址 Tokyo JP