| 主权项 |
1. A cushioned wafer container system having removable wafer cushions for transporting large-diameter wafers, the system comprising:
a wafer container enclosure configured to contain a plurality of semiconductor wafers, each wafer including a wafer periphery defining a first, second, third, and fourth quadrant, the wafer container defining a front opening and comprising a rear wall, and a plurality of wafer supports defining a plurality of slots for receiving edge portions of a plurality of wafers, the wafer supports supporting a first portion of a first quadrant periphery of the wafer and a first portion of a fourth quadrant periphery of the wafer; a front door configured to attach to the wafer enclosure at the front opening and defining a front side and a rear side, the rear side presenting itself to an interior of the wafer enclosure; a primary wafer cushion coupled to a rear side of the front door at a central portion of the front door, the primary wafer cushion defining a plurality of wafer grooves configured to receive and support a second portion of the first quadrant periphery of the wafer and a second portion of the fourth quadrant periphery of the wafer, each of the grooves of the primary wafer cushion aligned with a slot of the wafer supports; a first removable wafer cushion attachable to the rear side of the front door adjacent a first side of the primary wafer cushion, the first removable wafer cushion defining a plurality of wafer-receiving grooves in alignment with the grooves of the primary wafer cushions and the wafer support slots, the first removable wafer cushion configured to support a third portion of the first quadrant periphery of the wafer; and a second removable wafer cushion attachable to the rear side of the front door adjacent a second side of the primary wafer cushion, the second removable wafer cushion defining a plurality of wafer-receiving grooves in alignment with the grooves of the primary wafer cushions and the wafer support slots, the second removable wafer cushion configured to support a third portion of the fourth quadrant periphery of the wafer. |
