| 摘要 |
<p>PURPOSE: An epoxy resin composition for sealing semiconductor device and semiconductor device using the same are provided to prevent the cracks or exfoliation even after reflow soldering process. CONSTITUTION: An epoxy resin composition comprises 2-10 parts epoxy resin, 2-10 parts phenol resin, 0.1-0.3 part curing accelerator, 80-94 parts inorganic filler, 0.5-5 parts flame retardant, and 0.001-5 parts acid anhydride represented by formula 1. In formula 1, X is single-bonded or C1-C4 alkylene group; and R is carboxyl group. The acid anhydride is trimellitic anhydride.</p> |
