发明名称 Thermal conduction device having a layered structure with different thermal characteristics of the layers
摘要 The present invention relates to relay thermal conductor made of material having better thermal conductivity coefficient, wherein which is thermal conductively coupled with heating or cooling first thermal body at one end or face thereof, and is coupled with interface thermal conductor having higher specific heat capacity at the other end or face thereof; the relay thermal conductor directly performs thermal conduction with second thermal body at another part thereof; and the interface thermal conductor having higher specific heat capacity is the thermal conducting carrier between the relay thermal conductor and the second thermal body.
申请公布号 EP2317272(B1) 申请公布日期 2015.03.25
申请号 EP20090252793 申请日期 2009.12.15
申请人 YANG, TAI-HER 发明人 YANG, TAI-HER
分类号 F28F13/00;A47J27/00;A47J27/02;A47J27/022;A47J36/02;F28F13/14;F28F13/18;F28F21/08;F28F23/00;H01L23/36;H01L23/367;H01L23/373 主分类号 F28F13/00
代理机构 代理人
主权项
地址