| 摘要 |
The invention concerns a monitored component connection comprising a first component forming a holding portion, a second component forming a receiving portion, and a connecting portion which holds the second component to the first component in the connected condition, wherein the connecting portion engages into a connection receiving means of the receiving portion. According to the invention it is proposed that for monitoring for an unwanted connection weakness in the component connection in the connected condition the connection receiving means can be acted upon with a testing pressure, and the testing pressure can be monitored for a defect deviation which is sufficient to indicate a connection weakness in the component connection in the connected condition. |
