发明名称 METAL FOIL AND ELECTRONIC DEVICE
摘要 There is provided a metal foil suitable for an electrode substrate for an electronic element, which makes it possible to suppress oxidation of the ultra-smooth surface and also prevent roll scratches when wound in a roll. The metal foil of the present invention is made of copper or copper alloy. The front surface of the metal foil has an ultra-smooth surface profile having an arithmetic mean roughness Ra of 30 nm or less as determined in accordance with JIS B 0601-2001. The back surface of the metal has a concave-dominant surface profile having a Pv/Pp ratio of 1.5 or more, the Pv/Pp ratio being a ratio of a maximum profile valley depth Pv to a maximum profile peak height Pp of a profile curve as determined in a rectangular area of 181 µm by 136 µm in accordance with JIS B 0601-2001.
申请公布号 KR20150032291(A) 申请公布日期 2015.03.25
申请号 KR20157000803 申请日期 2013.04.24
申请人 MITSUI MINING & SMELTING CO., LTD. 发明人 MATSUURA YOSHINORI;KITAJIMA NOZOMU;NAKAMURA TOSHIMI;MYOI MASAHARU
分类号 H01L51/44;H01L51/52;H05B33/26 主分类号 H01L51/44
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