| 摘要 |
<p>To improve heat conductivity and heat dissipating characteristics of an insulating layer formed in a conductor plate shape. A conductor plate (315) and a module case (304) are bonded to each other by means of an insulating layer (700). The insulating layer (700) is configured by including a sprayed film (710), and an insulating film (720) that is provided on the sprayed film (710). The insulating film (720) is configured of a resin (721) that contains a filler (722), such as a ceramic, and a part of the filler-containing resin is applied to the inside of holes (712) in a sprayed material (711) constituting the sprayed film (710).</p> |
