PRINTED CIRCUIT BOARD WITH AN INSULATED METAL SUBSTRATE

摘要

The invention relates to a printed circuit board (1) with an insulated metal substrate, comprising a metal carrier (2), an insulating layer (4) and a metal layer (3) on which at least one electronic component (5) is mounted in at least one mounting zone (3A) of the metal layer (3), characterized in that each mounting zone (3A) is a raised zone of the metal layer (3).