发明名称 裏側からのアクセスを用いた集積回路チップのカスタム化
摘要 An integrated circuit, a method for making an integrated circuit product, and methods for customizing an integrated circuit are disclosed. Integrated circuit elements including programmable elements, such as fuses, PROMs, RRAMs, MRAMs, or the like, are formed on the frontside of a substrate. Vias are formed through the substrate from its frontside to its backside to establish conduction paths to at least some of the programmable elements from the backside. A programming stimulus is applied to at least some of the vias from the backside to program at least some of the frontside programmable elements.
申请公布号 JP5689977(B2) 申请公布日期 2015.03.25
申请号 JP20130537845 申请日期 2011.11.04
申请人 クアルコム,インコーポレイテッド 发明人
分类号 H01L27/10;H01L21/3205;H01L21/768;H01L21/82;H01L21/822;H01L21/8246;H01L23/522;H01L27/04;H01L27/105 主分类号 H01L27/10
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