发明名称 |
CONDUCTIVE PASTE, METHOD FOR FORMING WIRING, ELECTRONIC COMPONENT, AND SILICON SOLAR CELL |
摘要 |
This conductive paste is such that the printing properties and sintering properties are superior and is formed such that resistance of wiring after sintering is lowered. This conductive paste is characterized by being formed from copper-based metal particles and by an aspect ratio (dmax/dmin), which is defined as the ratio of the maximum diameter (dmax) and minimum diameter (dmin) for the metal particles, being greater than or equal to 1.0 and smaller than 2.2. |
申请公布号 |
EP2851907(A1) |
申请公布日期 |
2015.03.25 |
申请号 |
EP20130790886 |
申请日期 |
2013.05.08 |
申请人 |
MATERIAL CONCEPT, INC. |
发明人 |
KOIKE, JUNICHI;HOANG, TRI HAI |
分类号 |
H01B1/22;B22F1/00;C22C9/00;H01B1/00;H01B13/00;H01L31/04;H05K1/09;H05K3/12 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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