发明名称 STRUCTURE FOR CONNECTING COOLING APPARATUS, COOLING APPARATUS, AND METHOD FOR CONNECTING COOLING APPARATUS
摘要 It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.
申请公布号 EP2851948(A1) 申请公布日期 2015.03.25
申请号 EP20130790140 申请日期 2013.05.10
申请人 NEC CORPORATION 发明人 MATSUNAGA, ARIHIRO;YOSHIKAWA, MINORU;SAKAMOTO, HITOSHI;SHOUJIGUCHI, AKIRA;CHIBA, MASAKI;INABA, KENICHI
分类号 H01L23/427;F28D15/02;H05K7/20 主分类号 H01L23/427
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