发明名称 |
STRUCTURE FOR CONNECTING COOLING APPARATUS, COOLING APPARATUS, AND METHOD FOR CONNECTING COOLING APPARATUS |
摘要 |
It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening. |
申请公布号 |
EP2851948(A1) |
申请公布日期 |
2015.03.25 |
申请号 |
EP20130790140 |
申请日期 |
2013.05.10 |
申请人 |
NEC CORPORATION |
发明人 |
MATSUNAGA, ARIHIRO;YOSHIKAWA, MINORU;SAKAMOTO, HITOSHI;SHOUJIGUCHI, AKIRA;CHIBA, MASAKI;INABA, KENICHI |
分类号 |
H01L23/427;F28D15/02;H05K7/20 |
主分类号 |
H01L23/427 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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