| 摘要 |
<p>A high frequency according to the embodiment of the present invention includes a module substrate, a first component which is formed on one side of the module substrate, a second component which is formed on one side of the module substrate, and a terminal structure which is formed on the bottom edge of the module substrate. The terminal structure includes a third component and a pad part which is formed on at least one side of the third component.</p> |
