| 发明名称 |
INTEGRATED CIRCUIT CHIP COOLING DEVICE |
| 摘要 |
The present invention relates to an integrated circuit chip cooling device. The integrated circuit chip cooling device according to the embodiment of the present invention includes a network of micropipes. The pipe parts are connected by valves. Each valve includes at least one dual layer strip. At each valve (218), the shape of at least one dual layer strip (221) is changed under the influence of the change of a temperature. |
| 申请公布号 |
KR20150032216(A) |
申请公布日期 |
2015.03.25 |
| 申请号 |
KR20140122991 |
申请日期 |
2014.09.16 |
| 申请人 |
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIESALTERNATIVES;STMICROELECTRONICS S.A.;STMICROELECTRONICS (CROLLES 2) SAS |
发明人 |
MONFRAY STEPHANE;LHOSTIS SANDRINE;MAITRE CHRISTOPHE;KOKSHAGINA OLGA;CORONEL PHILIPPE |
| 分类号 |
H01L23/34;H01L23/46 |
主分类号 |
H01L23/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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