| 摘要 |
<p>The invention relates to an electrical component (1) comprising at least one cable element (2), at least one solder joint (12), at least one hotmelt element (22) and at least one substrate element (8). The cable element (2) is connected with the substrate element (8) by the solder joint (12). To improve the data transmission rate, the at least one solder joint (12) is not embedded in the hotmelt element (22). Preferably, the solder joint (12) is not covered the hotmelt material of the hotmelt element (22).</p> |
