| 摘要 |
The electric part (30, 30x, 40, 40x) to be soldered to a metal pad (P1, P2) formed at a surface of a printed circuit board (P), includes a first surface (51, 61) facing the metal pad (P1, P2), a second surface (52, 62) extending from the first surface (51, 61) in a direction away from the metal pad (P1, P2), and a third surface (53, 63) outwardly extending from the second surface (52, 62), wherein the second surface (52, 62) and the third surface (53, 63) define a space (S1, S2) in which solder (B) is stored. |
