Light emitting device package, method of manufacturing the same, and lighting system

摘要

Disclosed are a light emitting device package, a method of manufacturing the same, and a lighting system. The light emitting device package includes a light emitting structure layer (50) including a first conductive semiconductor layer (20), an active layer (30) partially formed under the first conductive semiconductor layer (20), and a second conductive semiconductor layer (40) under the active layer (30), an insulating layer (60) disposed on lateral surfaces of the active layer (30) and the second conductive semiconductor layer (40) and partially disposed under the second conductive semiconductor layer (40), an electrode (80) disposed under the first conductive semiconductor layer (20) and electrically insulated from the active layer (30) and the second conductive semiconductor layer (40) by the insulating layer (60), and a metallic support layer (90) disposed under the second conductive semiconductor layer (40), the insulating layer (60), and the electrode (80) and including a first conductive region (91) electrically connected to the electrode (80), a second conductive region (92) electrically connected to the second conductive semiconductor layer (40), and an insulating region (93) disposed between the first and second conductive regions (91,92) and electrically insulating the first conductive region (91) from the second conductive region (92).