发明名称 発光装置およびその製造方法
摘要 PROBLEM TO BE SOLVED: To provide a light-emitting device having high heat resistance, light resistance, gas shut-off property, and environmental resistance, and to provide a process of manufacturing the same.SOLUTION: In the light-emitting device, at least a top face of an LED chip 46 is exposed outside of a primer 40, and the primer 40 does not exist between the LED chip 46 and a base part 42A. Since the primer 40 does not cover the LED chip 46, there is no attenuation and confusion of light, and discoloration of the primer 40 caused by heat generation of the LED chip 46 can be prevented.
申请公布号 JP5690871(B2) 申请公布日期 2015.03.25
申请号 JP20130119158 申请日期 2013.06.05
申请人 シャープ株式会社 发明人 竹中 靖二;竹本 理史;青木 信明
分类号 H01L33/52 主分类号 H01L33/52
代理机构 代理人
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