| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a ring frame which has a long communication distance of a data carrier and a process control system which uses the ring frame. <P>SOLUTION: A ring frame 1 is used for a semiconductor wafer manufacturing. The ring frame 1 includes a frame body 2 formed by molding a thermoplastic resin into a ring shape; and a data carrier 3 having a shape formed along the ring shape of the frame body 2. A process control system includes the ring frame 1 and a reader and transmits/receives control information of the semiconductor wafer manufacturing process to/from the data carrier in a non-contact manner. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
