| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a micro mechanical oscillator capable of being set in an optional tensile stress in manufacturing by a simple process. <P>SOLUTION: Two etching mask patterns 2 and two double-end supported beam type patterns 3 are formed on a silicon substrate 1 (Fig.1(A), Fig.1(B)). Silicon is wet etched (Fig.1(C), Fig.1(D)). The silicon substrate 1 is cleaned with pure water, and is naturally dried in the atmosphere. In the naturally drying process, the two double-end supported beam type patterns 3 pull, abut, and adhere with each other by surface tension of water. The micro mechanical oscillator includes two supporting parts 10 formed on the silicon substrate 1, and two beam parts 11 supported in the state of being floated from the silicon substrate 1 by abutting and fixing a part thereof and fixing both ends by the two supporting parts 10 (Fig.1(E), Fig.1(F)). <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
